JEMISEYE, A. E.; SOBAMOWO, G. M.; MAYOWA, O. O. Transient Thermal Cooling of Electronics Systems using Functional Graded Fins: Hybrid Computational Analysis . The Journal of Engineering and Exact Sciences, Viçosa/MG, BR, v. 9, n. 4, p. 15810–01e, 2023. DOI: 10.18540/jcecvl9iss4pp15810-01e. Disponível em: https://periodicos.ufv.br/jcec/article/view/15810. Acesso em: 21 nov. 2024.