Transient Thermal Cooling of Electronics Systems using Functional Graded Fins: Hybrid Computational Analysis

Resumen

Passive cooling of electronics systems requires the use of fins and spines. Improved heat transfer enhancements in the systems have been achieved through porosity, magnetic field,  functionally graded materials, etc. However, the space and time-dependent analysis of passive device with inherent nonlinearities and explorations of conditions at the tip have not been fully presented. Therefore, this work presents an application of hybrid computation analysis using combined methods of Laplace transformation and Legendre wavelet collocation to the space and time-dependent nonlinear thermal models of a longitudinal conductive-radiative functionally graded extended surface. The spatial-dependent thermal conductivity is considered for three different cases. The present analysis results demonstrated good agreement with numerical results. The significances of the model's pertinent parameters on the fin’s performance are thoroughly considered and scrutinized with the aid of graphical illustrations. The fin tip thermal response decreases with an increase in conductive-convective parameters, but it increases as time progresses. The in-homogeneity index is directly proportional to the FGM fin temperature. However, the convective term is inversely proportional to the fin’s thermal distribution. The fin temperature under quadratic-law heat conductivity of the passive device shows an enhanced performance of lower thermal distribution than the linear- and exponential-law heat conductivity.  Ultimately, the study provides a very useful in the design of the fin with FGM.